JPH0729579Y2 - コネクタ接続構造 - Google Patents
コネクタ接続構造Info
- Publication number
- JPH0729579Y2 JPH0729579Y2 JP1990062759U JP6275990U JPH0729579Y2 JP H0729579 Y2 JPH0729579 Y2 JP H0729579Y2 JP 1990062759 U JP1990062759 U JP 1990062759U JP 6275990 U JP6275990 U JP 6275990U JP H0729579 Y2 JPH0729579 Y2 JP H0729579Y2
- Authority
- JP
- Japan
- Prior art keywords
- connector
- lead
- connection structure
- lead portion
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 description 16
- 238000005476 soldering Methods 0.000 description 11
- 230000008569 process Effects 0.000 description 8
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011295 pitch Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 206010040844 Skin exfoliation Diseases 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990062759U JPH0729579Y2 (ja) | 1990-06-15 | 1990-06-15 | コネクタ接続構造 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990062759U JPH0729579Y2 (ja) | 1990-06-15 | 1990-06-15 | コネクタ接続構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0423063U JPH0423063U (en]) | 1992-02-25 |
JPH0729579Y2 true JPH0729579Y2 (ja) | 1995-07-05 |
Family
ID=31592200
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990062759U Expired - Lifetime JPH0729579Y2 (ja) | 1990-06-15 | 1990-06-15 | コネクタ接続構造 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0729579Y2 (en]) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012150953A (ja) * | 2011-01-18 | 2012-08-09 | Mitsubishi Electric Corp | コネクタ接続構造およびその製造方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55165584A (en) * | 1979-06-08 | 1980-12-24 | Nippon Electric Co | Electric part and method of bending lead wire of electric part |
JPH0226270U (en]) * | 1988-08-05 | 1990-02-21 |
-
1990
- 1990-06-15 JP JP1990062759U patent/JPH0729579Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0423063U (en]) | 1992-02-25 |
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